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IC Testing & Sorting Machine

IC Testing & Sorting Machine

Applicable Components: DFN, QFN, SOIC, SOP, SOD, SOT, SMD inductors, capacitors, resistors and other chip devices

Main Functions: Automatic feeding, orientation detection, 5S inspection, 3D inspection, laser marking, electrical testing, sorting and taping

Overall Dimension: L1200 × W1000 × H1600 mm

Feeding Mode: Bulk material, tray, tube feeding

Discharging Mode: Tape output, tray output, NG material bin

Number of Suction Nozzles: 18

Test Stations: 4

UPH: Over 35,000 (no-load)

Test Pressure: 0.5kg–7kg

Power Supply: AC220V, 2.5 KW

Host Computer: Automatic control, CCD identification, judgment & calibration, test data recording

ATE Platform: Data configuration, display, analysis and judgment between machine and testers; automatic calibration of test links; data upload and storage for MES system


Product Details

 This high-speed IC testing and sorting machine realizes fully automatic handling, multi-dimensional visual inspection, electrical performance testing and taping packaging for small semiconductor components. With multi-station parallel design, it achieves high UPH stable production. It supports multiple feeding and discharging forms and can connect with ATE and MES systems, widely adopted in semiconductor packaging and testing factories.